Material verification & FIFO
Barcode-scanned reels, anti-error feeding, and first-in-first-out storage — before a single part is placed.
Across 11 SMT lines, in parallel
4 nitrogen-atmosphere
Full 3D SPI & AOI coverage on SMT boards · X-Ray available
Two-thirds of our reflow capacity is nitrogen. All optical inspection is 3D. Every board carries a unique barcode from first paste to final test.
That is the configuration behind automotive, medical and other high-reliability PCBA — and it is our baseline, not an upgrade.
Barcode-scanned reels, anti-error feeding, and first-in-first-out storage — before a single part is placed.
4 nitrogen ovens, 9× 3D SPI, 5× 3D AOI and X-Ray — the reliability core of the line.
See how one board barcode links its material, machine, operator, time and inspection data.
Parallel machines, high speed
imperial ~0.4 × 0.2 mm · BGA/µBGA/QFN supported
Zone-controlled thermal curve
Mass soldering of through-hole components for mixed-technology boards.
Microscope-verified cleanliness (60–80×) against our acceptance standard — for assemblies with stringent cleanliness requirements.

Unique barcode per board — material lot, machine, operator, time.
Reel barcodes verified against the program — wrong part halts the line.
SPI / AOI / X-Ray data feed MES; anomalies auto-stop and lock boards.
Automated racks with first-in-first-out control, synced to MES.




Imperial 01005 (~0.4 × 0.2 mm) placed daily on YAMAHA YSM20R-2 / YSM10 machines.
Original ZSR feeders for 4 mm tape — reliable 01005 feeding, not common on standard lines.
Solder-paste dipping process, warpage control and X-Ray verification — in stable production.
Sinic-Tek A510D with AI inspection, linked live to MES.








Nitrogen reflow, 100% 3D SPI & AOI inspection and cleaning as the baseline.
Print to functional test in-house, fully traceable, anti-error controlled.
26 placement machines across 11 SMT lines scale with you — from first sample to mass production.